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Journal
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2022 |
Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints
Son Kirak Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501 |
2 |
원문
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Conference
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2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
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Journal
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2012 |
Formation of Metal and Dielectric Liners Using a Solution Process for Deep Trench Capacitors
Ham Yong-Hyun Journal of Nanoscience and Nanotechnology, v.12, no.7, pp.5897-5901 |
1 |
원문
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