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Journal
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2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
|
|
Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
원문
|
|
Conference
|
2017 |
Solvent-free Fluxing Underfill Film for Electrical Interconnection
Keonsoo Jang European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
3 |
원문
|
|
Journal
|
2017 |
Organic Vapor-Jet-based Route for Solvent-Free Additive Formation of Oxide Semiconductors
최정민 Organic Electronics, v.43, pp.235-239 |
4 |
원문
|
|
Journal
|
2013 |
Rapid and Ecofriendly Esterification of Alcohols with 2-Acylpyridazinones
김보람 Bulletin of the Korean Chemical Society, v.34, no.11, pp.3410-3414 |
7 |
원문
|