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Journal
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2024 |
Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging
Eom Yong Sung ETRI Journal, v.46, no.2, pp.347-359 |
9 |
원문
|
|
Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
|
|
Journal
|
2014 |
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Eom Yong Sung ETRI Journal, v.36, no.3, pp.343-351 |
35 |
원문
|