Subjects : wafer level packaging
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems Jiho Joo International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 | ||
| Conference | 2011 | Cost-Effective and High-Performance FBAR Duplexer Module with Wafer Level Packaging Bae Hyun-Cheol Asia-Pacific Microwave Conference (APMC) 2011, pp.1074-1077 | ||
| Conference | 2002 | The effect of via size on fine pitch and high density solder bumps for wafer level packaging Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 | 원문 |
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