Subjects : System in package (SIP)
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2016 | Design of a Low Temperature Co-fired Ceramics (LTCC) based Antenna with Broadband and High Gain at 60GHz Bands Kim Dong-Young International Conference on Consumer Electronics (ICCE) 2016 : Asia, pp.156-158 | 0 | 원문 |
| Conference | 2010 | 3D SiP Module using TSV and Novel Solder Bump Maker Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 | 5 | 원문 |
| Journal | 2009 | IC with EMC 분야의 전세계 특허 동향 분석 Lee Byoung Nam 주간기술동향, v.1423, pp.14-27 | ||
| Journal | 2008 | 3D SiP(System-in-Package) 기술 동향 Choi Kwang-Seong 주간기술동향, v.1367, pp.14-27 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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