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Conference
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2024 |
Highly efficient vertical outgassing channel technique for direct wafer bonding and III-V membrane regrowth
Park Honghwi 한국반도체 학술대회 (KCS) 2024, pp.1-3 |
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Journal
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2017 |
Technical Trend of Fusion Semiconductor Devices Composed of Silicon and Compound Materials
Lee Sang-Heung 전자통신동향분석, v.32, no.6, pp.8-16 |
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원문
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Conference
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2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
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Conference
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2010 |
Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks
임병옥 Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 |
6 |
원문
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