Subjects : Packaging structure
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2007 | Development of the Micro Capillary Pumped Loop for Electronic Cooling Moon Seok-Hwan International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC) 2007, pp.72-76 | 8 | 원문 |
| Journal | 2007 | O/E Integration of Polymer Waveguide Devices by Using Replication Technology Jin Tae Kim IEEE Journal of Selected Topics in Quantum Electronics, v.13, no.2, pp.177-184 | 10 | 원문 |
| Conference | 2006 | Development of the Micro CPL for a Thin Packaging Structure Moon Seok-Hwan International Heat Pipe Symposium (IHPS) 2006, pp.72-76 | ||
| Conference | 2006 | Development of Cooling Device for thin Packaging Structure Moon Seok-Hwan 한국반도체 학술 대회 (KCS) 2006, pp.1-2 | ||
| Conference | 2003 | Packaging technology for wavelength tunable filter based on optical MEMS Eom Yong Sung IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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