Subjects : 3D SiP
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2012 | 3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process Bae Hyun-Cheol Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 | 1 | 원문 |
| Conference | 2010 | 3D SiP Module using TSV and Novel Solder Bump Maker Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 | 5 | 원문 |
| Journal | 2008 | 3D SiP(System-in-Package) 기술 동향 Choi Kwang-Seong 주간기술동향, v.1367, pp.14-27 |
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| Type | Year | Research Project | Primary Investigator | Download |
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