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Conference
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2025 |
2.5D/3D Stacked Optical Chiplet Enabling Tera bit/s-Scale Optical Interfaces: Advanced Packaging and Material Innovations
Lee Jyung Chan International Conference on the Physics of Non-Crystalline Solids (PNCS) 2025, pp.62-62 |
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Conference
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2015 |
Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 |
4 |
원문
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Journal
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2008 |
Three-Dimensionally Stacked Poly-Si TFT CMOS Inverter with High Quality Laser Crystallized Channel on Si Substrate
Oh Soon-Young Solid-State Electronics, v.52, no.3, pp.372-376 |
8 |
원문
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