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Journal
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2017 |
The Carbon Wire Bundle’s Constructing as a Capillary Wick in the Flat Thin Heat Pipe
Moon Seok-Hwan Applied Thermal Engineering, v.126, pp.1177-1184 |
13 |
원문
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Journal
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2011 |
Development of a Flat-Plate Cooling Device for Electronic Packaging
Moon Seok-Hwan ETRI Journal, v.33, no.4, pp.645-647 |
6 |
원문
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Journal
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2010 |
Development of Small Flat Plate Type Cooling Device
Moon Seok-Hwan 설비공학논문집, v.22, no.9, pp.614-619 |
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Conference
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2008 |
Development of Flat Plate Type Small Cooling Device
Moon Seok-Hwan 대한설비공학회 학술 발표 대회 (동계) 2008, pp.170-174 |
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Conference
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2007 |
Development of the Micro Capillary Pumped Loop for Electronic Cooling
Moon Seok-Hwan International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC) 2007, pp.72-76 |
8 |
원문
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Conference
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2006 |
Development of the Micro CPL for a Thin Packaging Structure
Moon Seok-Hwan International Heat Pipe Symposium (IHPS) 2006, pp.72-76 |
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