Subjects :
Young's Modulus
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
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2018 |
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247 |
24 |
원문
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Journal
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2018 |
Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis
Keonsoo Jang Journal of Applied Polymer Science, v.135, no.33, pp.1-9 |
16 |
원문
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|
Conference
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2017 |
Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test
주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 |
8 |
원문
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|
Journal
|
2017 |
Silicone‐Based Adhesives with Highly Tunable Adhesion Force for Skin‐Contact Applications
Bong Kuk Lee Advanced Healthcare Materials, v.6, no.22, pp.1-8 |
50 |
원문
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|
Journal
|
2013 |
Poly(ethylene glycol)-Functionalized Photocurable Silsesquioxane as an Antibiofouling Material for Nanostructure-Based Biomedical Applications
Bong Kuk Lee Japanese Journal of Applied Physics, v.52, no.6 PART 2, pp.1-6 |
1 |
원문
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|
Journal
|
2010 |
MEMS-Based Power Generation System Using Contractile Force Generated by Self-Organized Cardiomyocytes
최은표 Sensors and Actuators B : Chemical, v.151, no.1, pp.291-296 |
11 |
원문
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특허 검색결과
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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