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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
|
|
Conference
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2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
원문
|
|
Conference
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2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
원문
|
|
Journal
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2017 |
Solution-processed Fabrication of Superhydrophobic Hierarchical Zinc Oxide Nanostructures via Nanotransfer Printing and Hydrothermal Growth
Sunghoon Hong Surface and Coatings Technology, v.331, pp.189-195 |
19 |
원문
|
|
Journal
|
2008 |
Quantum-dot light-emitting diodes utilizing CdSe∕ZnS nanocrystals embedded in TiO2 thin film
강승희 Applied Physics Letters, v.93, no.19, pp.1-3 |
30 |
원문
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