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Conference
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2022 |
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
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Conference
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2021 |
Analysis of Parasitic Effects by Bonding Structure
Hyun-Gyu Jang International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.434-435 |
0 |
원문
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Conference
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2020 |
1700 V Full-SiC Half-bridge Power Module with Low Switching Loss
Jung Dong Yun Electronic System-Integration Technology Conference (ESTC) 2020, pp.1-4 |
1 |
원문
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