Subjects :
curing process
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
|
Conference
|
2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
7 |
원문
|
|
Journal
|
2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
원문
|
|
Conference
|
2013 |
P.108: Organic Wrinkles as Optical Scattering Sources
Jaehyun Moon Society for Information Display (SID) International Symposium 2013, v.44, no.1, pp.1395-1396 |
0 |
원문
|
|
Conference
|
2004 |
Hot-embossed polymeric optical waveguides
Choi Choon Gi Active and Passive Optical Components for WDM Communications IV (SPIE 5595), pp.98-111 |
1 |
원문
|
|
Journal
|
2003 |
Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process
Choi Choon Gi IEEE Photonics Technology Letters, v.15, no.6, pp.825-827 |
65 |
원문
|
|
Journal
|
2000 |
Polarization dependent loss in polymeric rib channel waveguide
Min Yoo Hong IEEE Photonics Technology Letters, v.12, no.11, pp.1483-1485 |
11 |
원문
|
특허 검색결과
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Patent Name |
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
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