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Journal
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2026 |
New insights into I-line stepper based InGaAs/InP double-heterojunction bipolar transistors (DHBTs)
Kang Soo Cheol Materials Science in Semiconductor Processing, v.201, pp.1-7 |
0 |
원문
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Journal
|
2026 |
New insights into I-line stepper based InGaAs/InP double-heterojunction bipolar transistors (DHBTs)
Jinchul Cho Materials Science in Semiconductor Processing, v.201, pp.1-7 |
0 |
원문
|
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Journal
|
2022 |
Direct patterning of colloidal quantum dots with adaptable dual-ligand surface
함동효 Nature Nanotechnology, v.17, no.9, pp.952-958 |
155 |
원문
|
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Journal
|
2022 |
Direct patterning of colloidal quantum dots with adaptable dual-ligand surface
김혁준 Nature Nanotechnology, v.17, no.9, pp.952-958 |
155 |
원문
|
|
Journal
|
2022 |
Direct patterning of colloidal quantum dots with adaptable dual-ligand surface
임재민 Nature Nanotechnology, v.17, no.9, pp.952-958 |
155 |
원문
|
|
Conference
|
2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
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원문
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