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Conference
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2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 optical transceiver and its key technologies
Lee Jyung Chan 광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-2 |
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Conference
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2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 chip-on-board (COB) and optical transceiver
Lee Jyung Chan 한국광학회 학술 발표회 (동계) 2023, pp.1-1 |
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Conference
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2016 |
Design of a Low Temperature Co-fired Ceramics (LTCC) based Antenna with Broadband and High Gain at 60GHz Bands
Kim Dong-Young International Conference on Consumer Electronics (ICCE) 2016 : Asia, pp.156-158 |
0 |
원문
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Journal
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2008 |
3D SiP(System-in-Package) 기술 동향
Choi Kwang-Seong 주간기술동향, v.1367, pp.14-27 |
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