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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
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Conference
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2012 |
High Power Light Emitting Diode with Graphene Transparent Electrode
Youn Doo Hyeb International Conference on Graphene 2012, pp.1-2 |
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Conference
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2010 |
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
성기준 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 |
4 |
원문
|
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Conference
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2009 |
Novel Bumping Material for Stacking Silicon Chips
Choi Kwang-Seong Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 |
2 |
원문
|
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Journal
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2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
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