Subjects : Ball bonding
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2022 | Low Height Wire bond Looping Technology Using Wedge Bonding for the MMIC Package 박아영 Electronic System-Integration Technology Conference (ESTC) 2022, pp.169-174 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2019 | OPTICAL MODULE AND SOLDER BALL BONDING STRUCTURE | UNITED STATES | ||
| Registered | 2019 | 광 모듈 및 솔더볼 접합 구조체 | KOREA | KIPRIS |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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