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Conference
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2025 |
Reliability Analysis of Fine-Pitch Interconnections Using Epoxy-Based Laser Bonding Materials with Different Glass Transition Temperatures
Lee Gaeun International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 |
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Conference
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2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
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원문
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Conference
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2017 |
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
Choi Kwang-Seong International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5 |
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원문
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