Subjects : low melting point
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2014 | Development of Low Contact Resistance Interconnection for Display Applications Haksun Lee Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 | 5 | 원문 |
| Journal | 2008 | Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 | 32 | 원문 |
| Journal | 2008 | Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 | 64 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2013 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2014 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2014 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2009 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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