Subject

Subjects : packaging material

  • Articles (5)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2023 Electronic Device Technologies for mm-Wave/THz Applications Using Special Packaging Materials: Research Overview and Possibility   Lee Jaeyeong  International Conference on Advanced Electromaterials (ICAE) 2023, pp.1-2
Journal 2020 Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging   Eom Yong Sung  전자통신동향분석, v.35, no.4, pp.1-10 원문
Journal 2018 Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis   Keonsoo Jang  Journal of Applied Polymer Science, v.135, no.33, pp.1-9 16 원문
Conference 2006 Low Noise and Power Amplifier Modules for 60 GHz Wireless Personal Area Network Applications   Mun Jae Kyoung  한국통신학회 종합 학술 발표회 (하계) 2006, pp.861-863
Conference 2006 Low Noise Amplifier Module for 60 GHz Wireless Personal Area Network (WPAN) utilizing Multilayer Low Temperature Co-fired Ceramic Technology   Mun Jae Kyoung  ESA Workshop on Millimetre Wave Technology and Applications 2006, pp.1-4
특허 검색결과
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연구보고서 검색결과
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