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Registered METHOD FOR TRANSFERRING AND BONDING OF DEVICES

Inventors
Application No.
17/228310 (2021.04.12)
Publication No.
US2021/0320236 A1 (2021.10.14)
Registration No.
11677060 (2023.06.13)
Country
UNITED STATES
Project Code
20PB1200, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications, Choi Kwang-Seong
20PB3300, Development of Equipment and Thermal Process Technology for Flexible Display and Devices, Choi Kwang-Seong
20PB2300, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module, Eom Yong Sung
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered 소자의 전사 및 접합 방법 KOREA KIPRIS
Registered 소자의 전사 및 접합 방법 KOREA KIPRIS
Registered 소자의 전사 및 접합 방법 KOREA KIPRIS
Registered METHOD FOR TRANSFERRING AND BONDING OF DEVICES UNITED STATES
Registered METHOD FOR TRANSFERRING AND BONDING OF DEVICES UNITED STATES