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Registered Wire for Electric Bonding

Inventors
Application No.
2021-0076827 (2021.06.14)
Publication No.
10-2022-0002099 (2022.01.06)
Registration No.
2606877 (2023.11.22)
Country
KOREA
Project Code
20PB4500, Technology of conductive interconnction material and mini LED package, Eom Yong Sung
20JB2300, Development of electroplating materials for semiconductor high-density modules, Eom Yong Sung
20PB1200, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications, Choi Kwang-Seong
20PB3300, Development of Equipment and Thermal Process Technology for Flexible Display and Devices, Choi Kwang-Seong
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패밀리 특허 목록
Status Patent Country KIPRIS
Registered Wire for Electric Bonding KOREA
Registered Wire for Electric Bonding KOREA
Registered Wire for Electric Bonding KOREA
Registered WIRE FOR ELECTRIC BONDING UNITED STATES
Registered WIRE FOR ELECTRIC BONDING UNITED STATES
Registered WIRE FOR ELECTRIC BONDING UNITED STATES
Registered WIRE FOR ELECTRIC BONDING UNITED STATES
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