Registered
WIRE FOR ELECTRIC BONDING
- Inventors
-
- Application No.
- 17/364128 (2021.06.30)
- Publication No.
- US2021/0402525 A1 (2021.12.30)
- Registration No.
- 11618109 (2023.04.04)
- Country
- UNITED STATES
- Project Code
-
20PB4500, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
-
20JB2300, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
-
20PB1200, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
-
20PB3300, Development of Equipment and Thermal Process Technology for Flexible Display and Devices,
Choi Kwang-Seong
- Family
-