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Registered 레이저 제어구조체 및 이를 이용한 레이저 접합 방법

Inventors
Application No.
2022-0073094 (2022.06.15)
Publication No.
10-2022-0169907 (2022.12.28)
Registration No.
2800954 (2025.04.22)
Country
KOREA
Project Code
21PB2200, Technology of conductive interconnction material and mini LED package, Eom Yong Sung
21JB3500, Development of electroplating materials for semiconductor high-density modules, Eom Yong Sung
21JB3200, Development of multi-functional core materials of transfer and bonding process for micro LEDs, Choi Kwang-Seong
, ,
KSP Keywords
Laser control, control structure
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered 레이저 제어구조체 및 이를 이용한 레이저 접합 방법 KOREA
Registered 레이저 제어구조체 및 이를 이용한 레이저 접합 방법 KOREA
Registered 레이저 제어구조체 및 이를 이용한 레이저 접합 방법 KOREA
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME UNITED STATES
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME UNITED STATES
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME UNITED STATES
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME UNITED STATES
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME CHINA
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME CHINA
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME CHINA
Registered LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME CHINA
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