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Registered 접착 소재 디핑 방법

Inventors
Application No.
2023-0175949 (2023.12.06)
Registration No.
2993524 (2026.07.15)
Country
KOREA
Project Code
23PB1300, Technology of conductive interconnction material and mini LED package, Eom Yong Sung
23JB2900, Development of multi-functional core materials of transfer and bonding process for micro LEDs, Choi Kwang-Seong
, ,
23JB2700, Development of electroplating materials for semiconductor high-density modules, Eom Yong Sung
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered 접착 소재 디핑 방법 KOREA
Registered 접착 소재 디핑 방법 KOREA
Registered 접착 소재 디핑 방법 KOREA