ETRI-Knowledge Sharing Plaform

KOREAN
연구보고서 검색
Type Funding Org. Research Org.
Year ~ Keyword

Detail

ICT 반도체 본딩용 다기능 One-stop 접합 소재 개발 (1차년도)
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Participants
장건수, 손지혜, 최광성, 엄용성
Published
201711
Type
Annual Report
Keyword
무세척 플럭스, SMT, Surface Maunt Technology
KSP Keywords
Flip-chip(FC), Flip-chip bonding, chip bonding, multi-functional, semiconductor device
Funding Org.
과학기술정보통신부
Research Org.
호전에이블
Project Code
17HB2800, One-stop Multi-functional Interconnection Material for Flip-chip bonding of ICT semiconductor device , Eom Yong Sung