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KOREAN
연구보고서 검색
Type Funding Org. Research Org.
Year ~ Keyword

Detail

6G 통신용 Sub-THz 대역 저유전 PCB 소재 및 기판 기술개발 (3차년도) (1단계)
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Participants
김동민, 강만구, 김선애, 배현철
Published
202512
Type
Annual Report
Keyword
저유전율, 석유수지, 동박 적층판, 할로겐-프리, 6G 통신, low dielectric constant, hydrocarbon resin, CCL(copper clad laminate), halogen-free, 6G Communication
KSP Keywords
Dielectric Constant, Low dielectric, Sub-THz, Substrate technology, THz band, low dielectric constant
Funding Org.
과학기술정보통신부
Research Org.
한국전자통신연구원
Project Code
25HB9400, Sub-THz low dielectric PCB material and substrate technology for 6G communication, Kang Mangu