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Conference
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2025 |
Thermal Simulation and Performance Analysis of a Novel High-Thermal-Conductivity Substrate Structure
김선애
대한전자공학회 학술 대회 (추계) 2025, pp.344-347 |
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Conference
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2025 |
Development of Hermetic package with 3.3kV SiC PIN diode
오애선
한국전기전자재료학회 학술 대회 (하계) 2025, pp.51-51 |
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Conference
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2025 |
Development of Hermetic package with 650V and 1200V SiC MOSFET for aerospace
오애선
한국전기전자재료학회 학술 대회 (하계) 2025, pp.50-50 |
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Conference
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2024 |
Results of SiC and GaN Power Module Manufacturing with Non-Pressure Ag Sintering Paste
오애선
SiC 반도체 컨퍼런스 2024, pp.53-53 |
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Conference
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2024 |
Improved thermal shock reliability of AlN substrates with high heat dissipation for electric vehicles
배현철
SiC 반도체 컨퍼런스 2024, pp.52-52 |
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Conference
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2023 |
Manufacturing of power module using base plate integrated Insulted metal substrate
배현철
한국전기전자재료학회 학술 대회 (하계) 2023, pp.1-1 |
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Conference
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2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효
대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
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Journal
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2023 |
Thermal Design of High Power Semiconductor Using Insulated Metal Substrate
정봉민
마이크로전자 및 패키징학회지, v.30, no.1, pp.63-70 |
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Conference
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2023 |
Measurement and comparison of low dielectric constant and loss characteristics of PCB material for 5G and Ka band
배현철
한국전자파학회 종합 학술 대회 (동계) 2023, pp.250-250 |
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Conference
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2022 |
Effect of Carbon Fiber and Glass Fiber on Thermo-mechanical Property of Polyether Ether Ketone for Power Module case of Electric Vehicle
손기락
한국복합재료학회 학술 발표 대회 (추계) 2022, pp.197-197 |
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Journal
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2018 |
NDR-effect Vertical-illumination-type Ge-on-Si Avalanche Photodetector
GYUNGOCK KIM
Optics Letters, v.43, no.22, pp.5583-5586 |
23 |
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