ETRI-Knowledge Sharing Plaform

Phase Change Material(PCM) Seebeck Coefficient Lens Array Applied Physics Reset Current Memory Applications Heating Layers Thermoelectric Device Low-Cost High Performance Light Extraction Efficiency Top Electrode Temperature Sensor(LM35) Top-Emitting Phase Transition Surface Tension(ST) Power Factor(P.F) Vacuum Deposition Test Structures Programming Current Nonvolatile Memory Devices Stress Reduction Highly Efficient Room-Temperature Complementary Metal-Oxide-Semiconductor(CMOS) Temperature Rise Sige Film Conductive Binders Electrical Conductivity(EC) Surface Treatments Switching Speed Current Efficiency Next-Generation Oled Lighting Two-Step Lithium-Ion Batteries(LIBs) Annealing Temperature Electrical Characterization Temperature Coefficient Of Resistance(TCR) Cost-Effective Threshold Voltage(Vth) Switching Characteristics High-Density Low Power Consumption All-Solid-State Batteries Process Parameters Organic Photodiode Lower Power High Temperature Chalcogenide Films Device Performance Chalcogenide Alloys Dry Process Extraction Structure Silicon On Insulator(SOI) Solid-State Battery Set Operation Control Device Gas Mixture Image Blurring Flexible Oled Low Noise Aqueous Binder Photoactive Layer Sputter-Deposited Tin Hard Mask Small-Sized Color Stability Carboxymethyl Cellulose Pulse Width Screen Printing Gas Mixing Liquid Electrolyte Key Factor Optical Properties Device Applications Fabrication Method Top-Down Process Near-Infrared(NIR) Electrical Resistance U-Shaped Indirect Heating On-Off Switch Gesbte Chalcogenide Time-Dependent Phase-Change Random Access Memory(PRAM) 20 Nm Secondary Battery Na-Cmc Energy Dispersive X-Ray Spectroscopy(EDX) Ostwald Ripening Gate Length Current Reduction Optical Simulation Highly Doped Oxide Layer Switching Behavior Scanning Thermal Microscopy Molybdenum Oxide Bulk Silicon Indium Tin Oxide(ITO) High Light Electrical Characteristics One-Step Programmable Switches Sputtering Power Memory Cell Stoney Equation Top-Down Approach Interfacial Conduction Silicon-Germanium(SiGe) Blue Organic Light Emitting Diodes Operational Stability Electrode Configuration Electrolyte-Free Cmos Process Bottom Electrode Highly Reliable Formation Mechanism Organic Films Grazing-Incidence Small-Angle X-Ray Scattering Semiconductor Technology Dry Etching Low Temperature(LT) Electrical Resistivity Barrier Metal P-Type Silicon Resistance Reduction Writing Current Thermoelectric Applications Capping Layer Initialization Vector(IV) Deposition Process Helicon Plasma Operating Temperature Amorphous Phase Silver Paste Oled Devices Heat Resistant Etching Process Electroless Copper Plating Silicon Nanowires (Sinws) Thermal Stability(TGA) Lithium Secondary Batteries Resistive Heating Subthreshold Swing(SS) Temperature Gradient Plasma Etching Micro-Heater On/Off Current Ratio Sige Alloy Single-Layer All-Solid-State Electrolyte Integrated Substrate Organic Vapor Phase Deposition Glass Substrate Compressive Stress Temperature Measurement Barrier Layers In-Situ Surface Modification Ceramic-Coated Separator Electronic Structure Analysis Research And Development 40 Nm Read Margin Sb Segregation Rapid Thermal Annealing(RTA) Program Disturbance On-State Resistance Electrical Properties(I-V curve) Switch Circuit Measurement Results Nitrogen-Doped Heterojunction Structure Molecular Network Substrate Surface Energy Fatigue Test Annealing Effects Doping Effects Electron States Light Intensity Operating Region Complete Crystallization Ratio Of Current Silicon Nitride Substrate Diameter Controllable Deposition Technique Cmos Compatible Process Channel Structure Thermally Stable Production Process Phase Separation Petri Net(PN) Pass Transistor Measurement System Growth Time Split-Gate Degradation Phenomena Thin Film Stress Ge-Sb-Te Alloy Nano-Structures Damp Heat Test Nucleation And Growth Out-Coupling Efficiency Functional Applications Image Quality Degradation Continuous Operation Reliability Problems Off-Leakage Current Current-Voltage Functional Materials On-Resistance Strategic Planning Moisture Exposure Ag Diffusion Controlling Process Film Stress Measurement Simulation And Measurement Lowest Unoccupied Molecular Orbital(LUMO) Multilayer Structure Double Layered Nanostructured Silicon It Industry Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Sulfide Electrolyte Oxide Field Synergetic Contribution Temperature Range Copolymer Films Storage Modulus Terminal Structure Alumina Substrate Saturation Current Structural Modification Active Loading Guided Modes Full-Color Self-Aligned Formation Reflection-Type Crystallization Process Channel Characteristics Absorption Features Device Architecture Thin Film Encapsulation Programmable Metallization Cell Top Illumination Water-Soluble Binder X-Ray Photoemission Spectroscopy Gas Barrier Extraction Method Small Molecular Failure Mode Temporal Response Memory Characteristics Tin Film Various Models Failure Behavior Voltage Coupling Oled Pixels Film Thickness Industry-Compatible Facile Route Oled Display Absolute Value Multiscale Simulations Coupling Ratio(CR) Wet Method Mechanical Reliability Polyvinyl Alcohol (Pva) Etching Technique 2-Ethylhexyl Acrylate(EHA) Power Distribution Reset And Set Situ Doping Threshold Switching High-Resolution Scattering Experiments Capacity Retention Nitrogen Doping Mixing Ratio Memory Behavior Solid Electrolyte Membrane Temperature Distribution New Approach Barrier Height Inhomogeneity Multi-State Cation-Exchange Reaction Memory Switching Encapsulation Material Current Rate Top Emission Smart Lighting Annealing Process Array Technology Time-Domain Simulations Electrode Contact Electrolyte Thin Film One-Dimensional Crystalline Phase Fabrication Process Technology Forecasting Adhesion Layer Weak Light Sn-Doped High Current Spectral Asymmetry Battery Anode Noise Equivalent Power Alloy Films 10-Phenanthroline(BCP) Floating Gate Magic Angle Silicon Junctions Refractive Index Contrast Ultraviolet Photoemission Spectroscopy(UPS) Heat Treatment Power Operation Optical Analysis Electronic Structures Receding Contact Angle Layered Phase State Of Charge (Soc) CHF 3 Loading Level Endurance Property Electrical Method Switching Element Temperature Difference Lithium Rechargeable Batteries Voltage Characteristics Lithium-Ion Transport Heating Temperature Hetero-Structure Array Process Resistance Change Multilayered Structure Atomic Ratio Finite Difference Time Domain(FDTD) Energy Conversion Systems Fabrication Technology Nonvolatile Logic Sputtering Method Thermodynamic Theory Thermal Insulation High Transmittance Charge Carriers Schottky Barrier Height Tactical Strategy LOW POWER AND HIGH SPEED Thin Channel Theoretical Calculation Low Power Applications Distribution Analysis Dot Pattern Silicon-Based Thin Films Rate Capability I-V Measurement Functional Additive Maskless Deposition Coating Process Flexible Optoelectronic Devices Trap-Assisted Tunneling High Efficiency Heat Stress Oxide-Semiconductor Field-Effect Transistors Etch Rates Volume Ratio Test Pattern Silicide Formation Frontier Orbitals Blue Oleds Light Outcoupling Deposition Method Initial Value Top-Illuminated Surface Smoothness High Thermal Conductivity Advanced Batteries Physical Separation Trapped Electron(TE) Lithium Battery Spontaneous Crystallization Resistive Switch Ag-Doped Retention Properties High Resistivity Transmission Electron Microscopy (Tem) Silicon Wafer Plasma-Enhanced Atomic Layer Deposition Extraction Technology Practical Application Pressure-Sensitive Adhesives Thermionic Emission Model Thermal Cycle Techno-Economic Study Phonon Transmission Thermal Barrier Built-In Self-Heating Oxygen Diffusion Efficiency Enhancement Different Materials Light Sources Performance Degradation Current Conduction Mechanisms N-Type Silicon Thermal Resistance Modified Separator Thin-Film Photodiode Schottky Diode Mechanical Properties(PMCs) Rf Sputtering Non-Volatility Surface Conditions Near-Edge X-Ray Absorption Fine Structure (Nexafs) Spectroscopy Smooth Surface Eco-Friendly Thermoelectric Properties High Chemical Stability Microscopy Analysis Gst Thin Films Gate Oxide Gst Materials Middle Layer Junction Interface Transport Of Charge Substrate Material Lattice Distortion Degree Of Substitution(d.s.) Charge Extraction Electronic Switching Doped Silicon High External Quantum Efficiency Mobile Ions Nickel Silicide P-N Heterojunction Active Phase Maximum Degree Thermal Release K-2 Tin Layer Diffusion Process Low Haze Formation Temperature Cl 2 Dc Current Potential Applications Temperature Increase Electrical Threshold Color Change Thermoelectric Performance Display Applications Initiated Chemical Vapor Deposition Short Channel Drain-Induced Barrier Lowering(DIBL) Future Energy Moderate Temperature 2-Hydroxyethylacrylate Target Temperature Luminance Distribution Sb Addition Creative Research Method If High Reliability Free-Standing Adhesion Strength Electro-Optical Patterning Process Solid-State Lithium Batteries Unique Solution Active Devices Polyolefin Fibers Capped Structure Phonon Propagation Scattering Centers Cell Resistance Scaled Down Curved Surface Scattering Effect Crystallization Speed Optical Characteristics Nanometer-Size At Interfaces Device Reliability Embedded Test Active Pore Size 9-Dimethyl-4 Channel Width Thermal Contact Resistance Active Layer Thickness Dwell Time Transparent Electrode Chalcogenide Glass(ChG) Aqueous Slurries Glass Fabric Low Melting Temperature Thermoelectric Materials Dark Current Operation Scheme Specific Detectivity Internal Resistance Hybrid Films Ti-Si-N Films Inter-Diffusion Foldable Devices Wide Viewing Angle Bulk Structure Electrochemical Measurements Total Power Photon Energy Low Thermal Expansion Switching Device Tungsten Electrode Eutectic Point Stable Performance Bulk Heterojunction Foldable Electronics Graphite Electrode Insulator Substrates Luminance Enhancement Wetting Behavior Oxide Charge Platinum Deposition Solid-State Alloying Electromagnetic Waves(EM) Higher Temperatures Conjugated Organic Molecules Contact Angle Measurements Linear Dynamic Range Dimensional Stability 7-Diphenyl-1 Material Composition Charge Transfer Resistance Conjugated Organic Materials Gibbs Free Energy Current Condition Highest Occupied Molecular Orbital Growth Behavior Manufacturing Processes Joule Heating CF 4 Vapor-Liquid-Solid Dynamic Contact Angle Area Ratio Gas Flow Rate Surface Modifier Enhancement Mechanism Set Speed High Haze Etching Characteristics Heat Flow Bilayer Structure Simulation Results Electric Field Memory Element Colorless Polyimide Interparticle Diffusion Poly(2-Ethyl-2-Oxazoline) Color Coordinates Technology Foresight Phosphorus Implantation Crystallization Rate Memory States Stainless Steel(SUS316) Laminated Structures New Device Detection Band K 1 Shear Strength Basic Structure Current Injection Volumetric Capacity Doping Concentration Rechargeable Battery Tilt Angle Morphological Changes Different Components Cycling Endurance Control Current Physical Degradation K-Edge Si Substrate