ETRI-Knowledge Sharing Plaform

Phase Change Material(PCM) Seebeck Coefficient Lens Array Applied Physics Memory Applications Thermoelectric Device Heating Layers Low-Cost High Performance Light Extraction Efficiency Top Electrode Reset Current Temperature Sensor(LM35) Top-Emitting Phase Transition Surface Tension(ST) Power Factor(P.F) Vacuum Deposition Nonvolatile Memory Devices Stress Reduction Conductive Binders Highly Efficient Room-Temperature Solid Electrolyte Complementary Metal-Oxide-Semiconductor(CMOS) Temperature Rise Sige Film Test Structures Electrical Conductivity(EC) Surface Treatments Switching Speed Current Efficiency Next-Generation Oled Lighting Two-Step Lithium-Ion Batteries(LIBs) Annealing Temperature Electrical Characterization Temperature Coefficient Of Resistance(TCR) Cost-Effective Flexible Oleds Threshold Voltage(Vth) Switching Characteristics High-Density Low Power Consumption Process Parameters Organic Photodiode Chalcogenide Films Chalcogenide Alloys Dry Process Extraction Structure Silicon On Insulator(SOI) Silicon-Germanium(SiGe) Gas Mixture Image Blurring Pulse Width Programming Current Photoactive Layer Sputter-Deposited Simulation Results Tin Hard Mask Small-Sized Color Stability Carboxymethyl Cellulose Screen Printing Key Factor Optical Properties Lower Power Device Applications High Temperature Fabrication Method Top-Down Process Near-Infrared(NIR) Electrical Resistance U-Shaped Indirect Heating On-Off Switch Gesbte Chalcogenide Time-Dependent Phase-Change Random Access Memory(PRAM) 20 Nm Na-Cmc Energy Dispersive X-Ray Spectroscopy(EDX) Ostwald Ripening Gate Length Current Reduction Optical Simulation Highly Doped Oxide Layer Switching Behavior Scanning Thermal Microscopy Molybdenum Oxide Bulk Silicon Indium Tin Oxide(ITO) High Light Electrical Characteristics One-Step Programmable Switches Solid-State Battery Stoney Equation Top-Down Approach Interfacial Conduction Set Operation Blue Organic Light Emitting Diodes Operational Stability Electrode Configuration Electrolyte-Free Control Device Cmos Process Low Noise Bottom Electrode Highly Reliable Formation Mechanism Organic Films Grazing-Incidence Small-Angle X-Ray Scattering Semiconductor Technology Dry Etching Low Temperature(LT) Barrier Metal P-Type Silicon Chalcogenide Material Resistance Reduction Thermoelectric Applications Capping Layer Deposition Process Programmable Metallization Cell Helicon Plasma Operating Temperature Amorphous Phase Silver Paste Oled Devices Heat Resistant Etching Process Electroless Copper Plating Silicon Nanowires (Sinws) Thermal Stability(TGA) Resistive Heating Subthreshold Swing(SS) Temperature Gradient Plasma Etching Micro-Heater All-Solid-State Batteries On/Off Current Ratio Sige Alloy Single-Layer All-Solid-State Electrolyte Integrated Substrate Organic Vapor Phase Deposition Glass Substrate Compressive Stress Temperature Measurement Barrier Layers Gas Mixing Liquid Electrolyte Ceramic-Coated Separator Electronic Structure Analysis Color Changes Research And Development 40 Nm Read Margin Sb Segregation Rapid Thermal Annealing(RTA) Program Disturbance On-State Resistance Electrical Properties(I-V curve) Switch Circuit Ti-Si-N Measurement Results Nitrogen-Doped Heterojunction Structure Molecular Network Substrate Surface Energy Fatigue Test Annealing Effects Device Structure Doping Effects Electron States Light Intensity Operating Region Complete Crystallization Ratio Of Current Silicon Nitride Substrate Diameter Controllable Deposition Technique Cmos Compatible Process Channel Structure Thermally Stable Production Process Phase Separation Petri Net(PN) Pass Transistor Measurement System Growth Time Bottom Layer Split-Gate Degradation Phenomena Thin Film Stress Ge-Sb-Te Alloy Nano-Structures Damp Heat Test Nucleation And Growth Out-Coupling Efficiency Functional Applications Electrical Resistivity Image Quality Degradation Continuous Operation Reliability Problems Off-Leakage Current Current-Voltage Functional Materials On-Resistance Strategic Planning Moisture Exposure Ag Diffusion Controlling Process Film Stress Measurement Single Cell Simulation And Measurement Lowest Unoccupied Molecular Orbital(LUMO) Multilayer Structure Double Layered Nanostructured Silicon It Industry Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Oxide Field Synergetic Contribution Temperature Range Writing Current Copolymer Films Storage Modulus Terminal Structure Alumina Substrate Saturation Current Active Loading Guided Modes Current Pulse Full-Color Self-Aligned Formation Reflection-Type Crystallization Process Channel Characteristics Absorption Features Device Architecture Thin Film Encapsulation Top Illumination Water-Soluble Binder Nanometer Size X-Ray Photoemission Spectroscopy Gas Barrier Extraction Method Small Molecular Failure Mode Temporal Response Memory Characteristics Tin Film Various Models Failure Behavior Voltage Coupling Oled Pixels Film Thickness Industry-Compatible Facile Route Oled Display Absolute Value Multiscale Simulations Coupling Ratio(CR) Wet Method Mechanical Reliability Polyvinyl Alcohol (Pva) Etching Technique 2-Ethylhexyl Acrylate(EHA) Power Distribution Reset And Set Lithium Secondary Batteries Situ Doping Threshold Switching High-Resolution Scattering Experiments Capacity Retention Nitrogen Doping Mixing Ratio Memory Behavior Temperature Distribution New Approach Barrier Height Inhomogeneity Multi-State Cation-Exchange Reaction Memory Switching Encapsulation Material Current Rate Top Emission Smart Lighting Annealing Process Array Technology Time-Domain Simulations Electrode Contact One-Dimensional Crystalline Phase Fabrication Process Technology Forecasting Adhesion Layer Weak Light Sn-Doped High Current Spectral Asymmetry Battery Anode Noise Equivalent Power Alloy Films 10-Phenanthroline(BCP) Floating Gate Magic Angle Silicon Junctions Refractive Index Contrast Ultraviolet Photoemission Spectroscopy(UPS) Heat Treatment Optical Analysis Electronic Structures Receding Contact Angle Layered Phase State Of Charge (Soc) CHF 3 Loading Level Endurance Property Electrical Method Switching Element Temperature Difference Voltage Characteristics Lithium-Ion Transport Heating Temperature Hetero-Structure Array Process Resistance Change Multilayered Structure Atomic Ratio Finite Difference Time Domain(FDTD) Energy Conversion Systems Fabrication Technology Nonvolatile Logic Sputtering Method Thermodynamic Theory Thermal Insulation Operational Performance High Transmittance Charge Carriers Schottky Barrier Height Tactical Strategy LOW POWER AND HIGH SPEED Thin Channel Theoretical Calculation Low Power Applications Distribution Analysis Dot Pattern Silicon-Based Thin Films Rate Capability I-V Measurement Functional Additive Maskless Deposition Coating Process Flexible Optoelectronic Devices Trap-Assisted Tunneling High Efficiency Heat Stress Oxide-Semiconductor Field-Effect Transistors Etch Rates Volume Ratio Test Pattern In-Situ Surface Modification Silicide Formation Frontier Orbitals Blue Oleds Light Outcoupling Deposition Method Initial Value Top-Illuminated High Thermal Conductivity Advanced Batteries Physical Separation Trapped Electron(TE) Aqueous Binders Spontaneous Crystallization Resistive Switch Ag-Doped Retention Properties High Resistivity Transmission Electron Microscopy (Tem) Silicon Wafer Plasma-Enhanced Atomic Layer Deposition Extraction Technology Practical Application Pressure-Sensitive Adhesives Thermionic Emission Model Thermal Cycle Techno-Economic Study Phonon Transmission Thermal Barrier Built-In Self-Heating Oxygen Diffusion Efficiency Enhancement Different Materials Light Sources Performance Degradation Current Conduction Mechanisms N-Type Silicon Thermal Resistance Secondary Battery Device Performance Modified Separator Thin-Film Photodiode Schottky Diode Mechanical Properties(PMCs) Rf Sputtering Non-Volatility Surface Conditions Near-Edge X-Ray Absorption Fine Structure (Nexafs) Spectroscopy Overall Resistance Smooth Surface Eco-Friendly Thermoelectric Properties High Chemical Stability Microscopy Analysis Gst Thin Films Gate Oxide Middle Layer Junction Interface Transport Of Charge Substrate Material Lattice Distortion Degree Of Substitution(d.s.) Charge Extraction Electronic Switching Lithium Rechargeable Battery Doped Silicon High External Quantum Efficiency Mobile Ions Nickel Silicide P-N Heterojunction Active Phase Maximum Degree Thermal Release K-2 Tin Layer Diffusion Process Low Haze Formation Temperature Cl 2 Dc Current Top Layer Potential Applications Temperature Increase Electrical Threshold Thermoelectric Performance Display Applications Initiated Chemical Vapor Deposition Short Channel Drain-Induced Barrier Lowering(DIBL) Future Energy Moderate Temperature 2-Hydroxyethylacrylate Target Temperature Luminance Distribution Sb Addition Creative Research Method If High Reliability Adhesion Strength Electro-Optical Patterning Process Unique Solution Active Devices Polyolefin Fibers Capped Structure Phonon Propagation Scattering Centers Cell Resistance Scaled Down Sputtering Power Curved Surface Scattering Effect Crystallization Speed Optical Characteristics Memory Cell At Interfaces Device Reliability Embedded Test Active Pore Size 9-Dimethyl-4 Channel Width Thermal Contact Resistance Active Layer Thickness Dwell Time Transparent Electrode Chalcogenide Glass(ChG) Aqueous Slurries Glass Fabric Low Melting Temperature Thermoelectric Materials Dark Current Specific Detectivity Internal Resistance Hybrid Films Inter-Diffusion Foldable Devices Wide Viewing Angle Bulk Structure Electrochemical Measurements Total Power Photon Energy Low Thermal Expansion Switching Device Tungsten Electrode Eutectic Point Stable Performance Bulk Heterojunction Foldable Electronics Graphite Electrode Insulator Substrates Luminance Enhancement Wetting Behavior Oxide Charge Platinum Deposition Solid-State Alloying Electromagnetic Waves(EM) Conjugated Organic Molecules Contact Angle Measurements Linear Dynamic Range Dimensional Stability 7-Diphenyl-1 Material Composition Charge Transfer Resistance Conjugated Organic Materials Gibbs Free Energy Current Condition Highest Occupied Molecular Orbital Growth Behavior Manufacturing Processes Joule Heating CF 4 Vapor-Liquid-Solid Dynamic Contact Angle Area Ratio Gas Flow Rate Surface Modifier Enhancement Mechanism Set Speed High Haze Etching Characteristics Heat Flow Bilayer Structure Electric Field Memory Element Colorless Polyimide Interparticle Diffusion Poly(2-Ethyl-2-Oxazoline) Color Coordinates Technology Foresight Phosphorus Implantation Crystallization Rate Memory States Stainless Steel(SUS316) Laminated Structures New Device Detection Band K 1 Shear Strength Basic Structure Current Injection Volumetric Capacity Diffusion Barrier(DB) Doping Concentration Tilt Angle Morphological Changes Different Components Cycling Endurance Control Current Physical Degradation K-Edge Si Substrate