Showing 36561-36570 of 40,960.
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2010 | Roly-poly: A Haptic Interface with a Self-Righting Feature Seung-Chan Kim International Conference on Haptics (EuroHaptics) 2010 (LNCS 6191), v.6191, pp.332-339 | 0 | |
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2010 | Load Performance Evaluation of the SSD According to the Number of Concurrent Users Seung-Kook Cheong International Conference on Future Generation Communication and Networking (FGCN) 2010 (CCIS 119), v.119, pp.132-136 | 1 | |
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2010 | MAMODE: A Routing Scheme Using Mixed Address Mode for Wireless Sensor Networks Jeongho Son International Conference on Security-Enriched Urban Computing and Smart Grid (SUComS) 2010 (CCIS 78), v.78, pp.367-375 | 0 | |
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2015 | IoT Sensor Data Collect Platform Chan-woo Park International Conference on Platform Technology and Service (PlatCon) 2015, pp.1-2 | ||
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2015 | A Collaboration Middleware for Service Scalability in Peer-to-Peer Systems Sung-Soo Kim International Conference on High Performance Computing and Simulation (HPCS) 2015, pp.269-276 | 0 | |
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2015 | A Design and Implementation of Lightweight ENC for Android App Moonsub Song International Conference on Future Information Technology (FutureTech) 2015 (LNEE 354), v.354, pp.137-143 | 0 | |
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2015 | AR Based Human Body Experience Game System Using Motion Recognition Sang-Hyun Seo International Conference on Platform Technology and Service (PlatCon) 2015, pp.1-2 | ||
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2015 | Centralized ARP Proxy Server over SDN Controller to Cut Down ARP Broadcast in Large-Scale Data Center Networks Hyunjeong Cho International Conference on Information Networking (ICOIN) 2015, pp.301-306 | 22 | |
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2015 | Challenging Issues in Visual Information Understanding Researches Kyuchang Kang International Conference on MultiMedia Modeling (MMM) 2015 (LNCS 8936), v.8936, pp.458-469 | 1 | |
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Conference
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2015 | Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module Kwang-Seong Choi Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 | 4 |