Showing 37691-37700 of 41,938.
| Type | Year | Title | Cited | Download |
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2022 | Downlink link-level Simulator designs for 3GPP Rel. 16 NR Non-Terrestrial Networks Gyeongrae Im Asia-Pacific Conference on Communications (APCC) 2022, pp.647-648 | 0 | |
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2021 | Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology Jiho Joo Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 | 5 | |
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2022 | Synthesizing a Reference Image from the Macro Images of a Painting for Vignetting Correction Soonchul Jung International Conference on Computational Science and Computational Intelligence (CSCI) 2022, pp.1-3 | 0 | |
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2022 | Low Height Wire bond Looping Technology Using Wedge Bonding for the MMIC Package Ah-Young Park Electronic System-Integration Technology Conference (ESTC) 2022, pp.169-174 | 0 | |
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2022 | Multifunctional Array of Organic Light-Emitting Diodes and Transparent Electrodes for in vivo Optogenetics and Electrophysiology Kukjoo Kim International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) 2022, pp.1-1 | ||
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2022 | Sequential Beam, User, and Power Allocation for Interference Management in 5G mmWave Networks Suyoung Ahn International Conference on Information Networking (ICOIN) 2022, pp.429-434 | 3 | |
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2022 | Performance analysis of Geo-fencing effect for Intruder Monitoring Young-il Kim International Conference on Computational Science and Computational Intelligence (CSCI) 2022, pp.1-7 | 1 | |
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2023 | Improvements of IoT Waveform for High Doppler Pansoo Kim Consumer Communications and Networking Conference (CCNC) 2023, pp.1-2 | 2 | |
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2023 | Delay Spread Model for Intra-Device Environments at 285 GHz Jong Ho Kim European Conference on Antennas and Propagation (EuCAP) 2023, pp.1-3 | 2 | |
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2023 | A Research on Low Latency Motion Control System using Real-time Scheduling in Edge Server Dongbeom Ko Jaeho Jeon International Conference on Information Networking (ICOIN) 2023, pp.537-540 | 1 |