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Conference
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2023 |
Electronic Device Technologies for mm-Wave/THz Applications Using Special Packaging Materials: Research Overview and Possibility
Jae-Yeong Lee
International Conference on Advanced Electromaterials (ICAE) 2023, pp.1-2 |
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Conference
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2023 |
BIPV 응용을 위한 Cu(In,Ga)Se2 박막 태양전지의 색상 구현 방법
Yong-Duck Chung
Asia-Pacific Forum on Renewable Energy 2023, pp.83-84 |
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Journal
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2023 |
Environmentally stable luminescent perovskite nanocrystals passivated and encapsulated by siloxane hybrids enabling reliable color-converted organic light-emitting diodes
Yongmin Shin
Hyungwoo Suh
Byoung-Hwa Kwon
Chemical Engineering Journal, v.474, pp.1-10 |
16 |
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Conference
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2023 |
Wireless network configuration technology for wireless data transmission within ships
Seung-Sik Lee
International Conference on Advanced Intelligent Maritime Safety and Technology (Ai-MAST) 2023, pp.211-214 |
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Journal
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2023 |
생성형 AI와 소셜 네트워크 서비스의 융합(AI-SNS) : 사회적 영향과 AI 윤리
방준성
미래연구, v.8, no.1, pp.113-135 |
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Conference
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2023 |
포토닉스 기반 sub-THz 대역의 무선 전송을 위한 증폭기 모듈 개발
김수연
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-2 |
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Conference
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2023 |
Analysis of Multilayer Shielding Panels With Absorbing Materials Between Two Conducting Plates
J. Kwon
Conference on Magnetism and Magnetic Materials (MMM) 2023, pp.233-234 |
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Conference
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2023 |
Effect of EM Absorbers Placed on Aperture Side within Enclosure on Shielding Effectiveness
J. Kwon
Conference on Magnetism and Magnetic Materials (MMM) 2023, pp.228-228 |
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Conference
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2023 |
Large Scale Integration of Stretchable Oxide TFTs
Himchan Oh
International Meeting on Information Display (IMID) 2023, pp.1-1 |
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Conference
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2023 |
94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
Jiho Joo
International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 |
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