Showing 6731-6740 of 42,135.
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2017 | From Architecture to Field Trial: A Millimeter Wave Based MHN System for HST Communications Toward 5G Heesang Chung European Conference on Networks and Communications (EuCNC) 2017, pp.1-5 | 18 | |
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2017 | Digital holographic display with two-dimensional and threedimensional convertible feature by high speed switchable diffuser Keehoon Hong International Symposium on Electronic Imaging Science and Technology (EI) 2017, pp.113-117 | ||
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2017 | Comparison of Charging Region Differences According to Receiver Structure in Drone Wireless Charging System Sang-Won Kim International Conference on Information and Communication Technology Convergence (ICTC) 2017, pp.1059-1061 | 17 | |
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2017 | 360-degree Color Hologram Generation for Real 3-D Object Eun-Young Chang Digital Holography and Three-Dimensional Imaging (DH) 2017, pp.1-3 | 0 | |
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2017 | The Analysis of Standardization and Technologies Trends for Efficient Data Transmission in Cable Based Network TaeKyoon Kim International Conference on Future Generation Communication and Networking (FGCN) 2017 (ASTL 146), pp.152-156 | ||
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2017 | TARMan: Topology-Aware Reliability Management for Softwarized Network Systems Haymanot Gebre-Amlak International Symposium on Local and Metropolitan Area Networks (LANMAN) 2017, pp.1-6 | 4 | |
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2017 | Development of 5G CHAMPION Testbeds for 5G Services at the 2018 Winter Olympic Games Seok Ho Won International Workshop on Signal Processing Advances in Wireless Communications (SPAWC) 2017, pp.1-5 | 14 | |
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2017 | Building a Big Data Platform for Large-scale Security Data Analysis Jong-Hoon Lee International Conference on Information and Communication Technology Convergence (ICTC) 2017, pp.977-981 | 5 | |
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2017 | A Threat Based Approach to Computational Offloading for Collaborative Cruise Control Al Tariq Sheik International Conference on Internet of Things, Data and Cloud Computing (ICC) 2017, pp.1-9 | 3 | 원문 |
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2017 | Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging Yong-Sung EOM European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 0 |