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Journal
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2018 |
Fabrication of Highly Transparent Electrochromic Mirror Device with Nanoporous Counter Electrode
Chil Seong Ah
Bulletin of the Korean Chemical Society, v.39, no.10, pp.1186-1192 |
13 |
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Journal
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2019 |
Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project: Technological Achievements and Experimental Results
Francesco Testa IEEE/OSA Journal of Lightwave Technology, v.37, no.2, pp.345-355 |
23 |
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Journal
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2019 |
Proposal of 28 GHz In Vitro Exposure System Based on Field Uniformity for Three‐Dimensional Cell Culture Experiments
Young Seung Lee
Bioelectromagnetics, v.40, no.7, pp.445-457 |
4 |
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Journal
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2020 |
Compliance Testing for Human Body Model Exposure to Electromagnetic Fields from a High-Power Wireless Charging System for Drones
Jangyong Ahn
Seon-Eui Hong
Radiation Protection Dosimetry, v.189, no.1, pp.13-27 |
1 |
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Journal
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2020 |
Effect of Exposure to a Radiofrequency Electromagnetic Field on Body Temperature in Anesthetized and Non‐Anesthetized Rats
Hye Sun Kim Bioelectromagnetics, v.41, no.2, pp.104-112 |
12 |
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Journal
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2020 |
Recess-Etched and Tetramethylammonium Hydroxide-Treated Nanoscale Pattern on AlGaN/GaN High-Electron-Mobility-Transistors for Improved Ohmic Contact
Hyun-Wook Jungy
Jae-Won Do Journal of the Korean Physical Society, v.76, no.9, pp.837-842 |
0 |
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Journal
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2009 |
Synthesis of Polystyrene Nanoparticles with Different Surface Modification by Emulsion Polymerization and Measurement of IgG Adsorption and Stability for the Application in Latex-Protein Complex Based Solid-Phase Immunoassay
Sang Hee Kim
Polymer Bulletin, v.62, no.1, pp.23-32 |
9 |
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Journal
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2008 |
Using Structured Light for Efficient Depth Edge Detection
Ji Young Park
Image and Vision Computing, v.26, no.11, pp.1449-1465 |
20 |
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Journal
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2008 |
Timing Estimation for OFDM Systems by Using a Correlation Sequence of Preamble
Yeon Su Kang IEEE Transactions on Consumer Electronics, v.54, no.4, pp.1600-1608 |
49 |
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Journal
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2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Yong-Sung Eom
Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
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