Subject

Subjects : Solder ball

  • Articles (2)
  • Patents (2)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2009 Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing   Keonsoo Jang  Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466 31 원문
Journal 2009 Development of High-Quality LTCC Solenoid Inductor using Solder Ball and Air Cavity for 3-D SiP   Bae Hyun-Cheol  한국마이크로전자 및 패키징학회지, v.46, no.4, pp.5-8
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
Registered 2019 OPTICAL MODULE AND SOLDER BALL BONDING STRUCTURE UNITED STATES
Registered 2019 광 모듈 및 솔더볼 접합 구조체 KOREA KIPRIS
연구보고서 검색결과
Type Year Research Project Primary Investigator Download
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