Subjects : Direct bonded copper (DBC)
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate 박성효 대한전자공학회 학술 대회 (하계) 2023, pp.116-119 | ||
| Journal | 2023 | Thermal Design of High Power Semiconductor Using Insulated Metal Substrate Jeong Bongmin 마이크로전자 및 패키징학회지, v.30, no.1, pp.63-70 | 원문 | |
| Conference | 2022 | Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 | ||
| Conference | 2020 | 1700 V Full-SiC Half-bridge Power Module with Low Switching Loss Jung Dong Yun Electronic System-Integration Technology Conference (ESTC) 2020, pp.1-4 | 1 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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