Subjects :
3D Integration
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
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2023 |
Ferroelectric Hafnia-Based M3D FeTFTs Annealed at Extremely Low Temperatures and TCAM Cells for Computing-in-Memory Applications
조홍래 ACS Applied Materials & Interfaces, v.15, no.44, pp.51339-51349 |
12 |
원문
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Conference
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2018 |
Integrated, Scalable and Reconfigurable Silicon Photonics based Optical Switch for Colorless, Directionless and Contentionless Operation
Stefano Tondini Optical Fiber Communication Conference (OFC) 2018, pp.1-3 |
0 |
원문
|
|
Journal
|
2010 |
Novel Maskless Bumping for 3D Integration
Choi Kwang-Seong ETRI Journal, v.32, no.2, pp.342-344 |
37 |
원문
|
|
Journal
|
2009 |
Fabrication of n-type Schottky barrier thin-film transistor with channel length and width of 0.1 μm and erbium silicide source/drain
Yang Jong-Heon Thin Solid Films, v.517, no.5, pp.1825-1828 |
5 |
원문
|
|
Journal
|
2007 |
A Fully Embedded LTCC Multilayer BPF for 3-D Integration of 40-GHz Radio
조윤희 IEEE Transactions on Advanced Packaging, v.30, no.3, pp.521-525 |
24 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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연구보고서 검색결과
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Year |
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