Subjects :
Electrical interconnections
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2018 |
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247 |
24 |
원문
|
|
Journal
|
2018 |
Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis
Keonsoo Jang Journal of Applied Polymer Science, v.135, no.33, pp.1-9 |
16 |
원문
|
|
Conference
|
2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
|
|
|
Journal
|
2006 |
Simultaneous Optical/Electrical Interconnection of Polymer Planar-Lightwave-Circuit Chip based on Polymer MOEMS and Replication Technology
Jin Tae Kim Sensors and Actuators A : Physical, v.126, no.2, pp.425-429 |
8 |
원문
|
특허 검색결과
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Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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