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Conference
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2024 |
A Comparative Study of Au Stud and Cu Pillar in Flip-Chip bonding for 2.5D/3D Integrated Terabit Optical Chiplet
Lee Jyung Chan Optics and Photonics Congress 2024, pp.1-1 |
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Journal
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2015 |
Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Bae Hyun-Cheol 한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59 |
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원문
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Conference
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2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
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Conference
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2013 |
Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump
Bae Hyun-Cheol European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4 |
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Journal
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2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
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