Subjects :
Solder bumping
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 |
14 |
원문
|
|
Journal
|
2014 |
Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
Haksun Lee IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 |
15 |
원문
|
|
Conference
|
2014 |
Development of Low Contact Resistance Interconnection for Display Applications
Haksun Lee Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 |
5 |
원문
|
|
Conference
|
2012 |
3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process
Bae Hyun-Cheol Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 |
1 |
원문
|
|
Conference
|
2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
원문
|
|
Conference
|
2009 |
Novel Bumping Material for Stacking Silicon Chips
Choi Kwang-Seong Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 |
2 |
원문
|
특허 검색결과
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Family Pat. |
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연구보고서 검색결과
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