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Conference
|
2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
7 |
원문
|
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Journal
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2022 |
Switching and Heat-Dissipation Performance Analysis of an LTCC-Based Leadless Surface Mount Package
Jung Dong Yun Journal of Semiconductor Technology and Science, v.22, no.1, pp.1-9 |
1 |
원문
|
|
Conference
|
2021 |
Switching and Heat-dissipation Performance Analysis of an LTCC-based Leadless Surface Mount Package Using a Power Factor Correction Converter
Jung Dong Yun International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.811-813 |
2 |
원문
|
|
Conference
|
2020 |
Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors
Jung Dong Yun International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606 |
4 |
원문
|
|
Journal
|
2017 |
A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp
Moon Seok-Hwan Applied Thermal Engineering, v.126, pp.1164-1169 |
38 |
원문
|
|
Journal
|
2013 |
380-nm Ultraviolet Light-Emitting Diodes with InGaN/AlGaN MQW Structure
Bae Sung-Bum ETRI Journal, v.35, no.4, pp.566-570 |
6 |
원문
|