Subjects :
Novel material
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Conference
|
2025 |
A Novel Photo-Patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-Chip Interconnections
Gwang-Mun Choi European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 |
0 |
원문
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|
Conference
|
2025 |
Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957 |
0 |
원문
|
|
Journal
|
2021 |
The Potassium‐Assisted P‐Type Characteristics of Tin Oxide in Solution‐Processed High‐Performance Metal Oxide Thin‐Film Transistors
Sooji Nam Physica Status Solidi (A) - Applications and Materials Science, v.218, no.18, pp.1-7 |
3 |
원문
|
|
Conference
|
2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
|
|
Journal
|
2013 |
Flexible and Transparent MoS2 Field-Effect Transistors on Hexagonal Boron Nitride-Graphene Heterostructures
이관형 ACS Nano, v.7, no.9, pp.7931-7936 |
1045 |
원문
|
|
Conference
|
2009 |
Novel Bumping Material for Stacking Silicon Chips
Choi Kwang-Seong Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 |
2 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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