Subjects : curing agent
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2022 | Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 | 8 | 원문 |
| Journal | 2016 | Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 | 5 | 원문 |
| Journal | 2009 | Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing Keonsoo Jang Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466 | 31 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2020 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | UNITED STATES | ||
| Registered | 2020 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | UNITED STATES | ||
| Registered | 2018 | Manufacturing and Method of Nano Composite Dispersion using Rotation and Revolution based on Magnetic Field | UNITED STATES | ||
| Registered | 2013 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2014 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2014 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2009 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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