Subjects :
thermocompression bonding
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
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2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
|
|
Conference
|
2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
5 |
원문
|
|
Journal
|
2018 |
Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices
Choi Kwang-Seong 전자통신동향분석, v.33, no.6, pp.50-57 |
|
원문
|
|
Journal
|
2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 |
14 |
원문
|
|
Journal
|
2016 |
Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules
Choi Kwang-Seong Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 |
2 |
원문
|
|
Conference
|
2015 |
Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 |
4 |
원문
|
특허 검색결과
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
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Download |
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