Subjects :
Optical Microscope
논문 검색결과
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Year |
Title |
Cited |
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Journal
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2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 |
5 |
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Journal
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2010 |
Characteristics of Via-Hole Interconnections Fabricated by Using an Inkjet Printing Method
Yong Suk Yang Journal of the Korean Physical Society, v.57, no.61, pp.1699-1701 |
5 |
원문
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Journal
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2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
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Journal
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2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
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Journal
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2007 |
Recent Progress of Nano-technology with NSOM
김준호 Micron, v.38, no.4, pp.409-426 |
93 |
원문
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Journal
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2005 |
Experimental Evaluation of Arrayed Microcolumns with Monolithic Structure
Jeong Jin Woo Japanese Journal of Applied Physics, v.44, no.7B, pp.5565-5569 |
3 |
원문
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Journal
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2004 |
다기능 탐침 정보저장 : 전계기록과 근접장 재생
Kang-Ho Park ETRI Journal, v.26, no.3, pp.189-194 |
1 |
원문
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
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