Subject

Subjects : Vertical Transition

  • Articles (7)
  • Patents (2)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2015 Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module   Choi Kwang-Seong  Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 4 원문
Conference 2013 Design and Verification of SMT MMIC Package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz Digital Attenuator   Ju In Kwon  Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2013, pp.255-258 2 원문
Journal 2010 40 GHz Vertical Transition with a Dual-Mode Cavity for a Low-Temperature Co-fired Ceramic Transceiver Module   Byun Woo Jin  ETRI Journal, v.32, no.2, pp.195-203 31 원문
Conference 2008 High Performance Vertical Transition from DC to 70 GHz for System-on-Package Applications   Ju In Kwon  European Microwave Conference (EuMC) 2008, pp.1338-1341 6 원문
Journal 2008 Low Loss DC to 50 GHz LTCC SMT Package for Millimeter Wave MMICs   Ju In Kwon  Microwave and Optical Technology Letters, v.50, no.1, pp.24-29 0 원문
Conference 2007 Design of Vertical Transition for 40GHz Transceiver Module Using LTCC Technology   Byun Woo Jin  European Micorwave Integrated Circuits Conference (EuMIC) 2007, pp.555-558 7 원문
Conference 2007 Novel Vertical Transition Using a Trough Line, a Slab Line and Shielded Multilayer Coplanar Waveguides for 50 GHz LTCC Hermetic SMT MMIC Package   Ju In Kwon  European Micorwave Integrated Circuits Conference (EuMIC) 2007, pp.563-566 3 원문
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
Registered 2008 초광대역 시스템 온 패키지 및 그 제조 방법 KOREA KIPRIS
Registered 2009 ULTRA WIDEBAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME UNITED STATES
연구보고서 검색결과
Type Year Research Project Primary Investigator Download
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