Subjects : Interconnection materials
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 | 1 | 원문 |
| Conference | 2023 | Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 | 0 | 원문 |
| Journal | 2020 | Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 | 원문 | |
| Conference | 2017 | Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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