Subjects : Bonding structure
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2025 | Mitigating hydrogen-related instabilities in oxide thin-film transistor via nitrogen-engineered passivation layer for thermal stability 이이삭 Applied Surface Science Advances, v.29, pp.1-11 | 0 | 원문 |
| Journal | 2025 | Mitigating hydrogen-related instabilities in oxide thin-film transistor via nitrogen-engineered passivation layer for thermal stability Na Jae Won Applied Surface Science Advances, v.29, pp.1-11 | 0 | 원문 |
| Conference | 2021 | Analysis of Parasitic Effects by Bonding Structure Hyun-Gyu Jang International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.434-435 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2019 | OPTICAL MODULE AND SOLDER BALL BONDING STRUCTURE | UNITED STATES | ||
| Registered | 2019 | 광 모듈 및 솔더볼 접합 구조체 | KOREA | KIPRIS |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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